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    分立器件
    分立器件
    Discrete Device

    Y7037PC(DLMUN2111)-1 3 数字管P

    ★  Y7037PC是利用硅外延工艺生产的PNP型带偏置电阻三极管芯片

    ★ 圆片尺寸:5英寸

    ★ 利用该芯片封装的三极管典型成品有LMUN2211

    ★ Y7037PC与Y7037NC构成互补对管

    ★ R1=10KΩ,R2=10KΩ

    ★ ICM =100mA,PCM =250mW(SOT-23),Tj:-55-150℃。

    ★ 芯片尺寸:0.37×0.37 (mm)2

    ★ 压焊区尺寸  B区压焊尺寸:90×90(μm) 2

                   E区压焊尺寸:100×100(μm) 2

    ★ 正面电极:铝,厚度2.5 mm

    ★ 芯片背极:背金(多层金)

       芯片背极为集电极,基极与发射极的键合点位置见右图

    ★ 芯片厚度:180±20 (mm)

    ★ 划片道宽度:50mm